AMAOE Q888 BGA Reballing Stencil for Qualcomm Snapdragon CPU Universal Tin Planting Steel Mesh

AMAOE Q888 BGA Reballing Stencil for Qualcomm Snapdragon CPU Universal Tin Planting Steel Mesh
артикул: 1005006072443067
$2.94+2%
$2.99
Доставка из: Китай

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100%
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AMAOE Q888 BGA Reballing Stencil for Qualcomm Snapdragon CPU Universal Tin Planting Steel Mesh
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+1%
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AMAOE SDM439 BGA Stencil Reballing For Qualcomm Snapdragon 439 CPU Planting Tin Steel Mesh Heating Template 0.12MM
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82%
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74%
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AMAOE SM8150 BGA Reballing Stencil for Qualcomm Snapdragon 855CPU Lower RAM Upper 0.12mm Tin Planting Steel Mesh
AMAOE SM8150 BGA Reballing Stencil for Qualcomm Snapdragon 855CPU Lower RAM Upper 0.12mm Tin Planting Steel Mesh
+1%
73%
$6.18
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64%
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62%
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Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 SM8350 CPU RAM IC Chipset Tin Net Planting Soldering Steel Mesh
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61%
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59%
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Amaoe HW16 BGA Reballing Stencil For Huawei Honor 50Pro Qualcomm Snapdragon 778G SM7325 MT6877V CPU Planting Tin Net Repair Tool
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57%
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54%
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Amaoe Q888 BGA Reballing Stencil for Qualcomm Snapdragon 888 CPU Upper Layer Lower Layer IC Chip Solder Heat Tin Plant Net
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47%
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45%
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44%
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35%
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Amaoe HW16 BGA Reballing Stencil for Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
34%
$4.50
Amaoe HW16 BGA Reballing Stencil for Huawei Glory 50/50pro Qualcomm Snapdragon 778G/SM7325 Tin Planting Net Steel Mesh
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-6%
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25%
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23%
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19%
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-3%
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15%
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13%
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