AMAOE Mbga-B6 BGA Reballing Platform Set for Android CPU 0.12mm Tin Planting Steel Mesh IC Chip Glue Removal Station Kit

AMAOE Mbga-B6 BGA Reballing Platform Set for Android CPU 0.12mm Tin Planting Steel Mesh IC Chip Glue Removal Station Kit
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sku: 1005005287086884
$12.49
Shipping from: China
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