AMAOE Hi6262 BGA Reballing Stencil for HUAWEI Watc3 CPU Hi6262 Integrated 0.12mm Tin Planting Steel Mesh

AMAOE Hi6262 BGA Reballing Stencil for HUAWEI Watc3 CPU Hi6262 Integrated 0.12mm Tin Planting Steel Mesh
sku: 1005006072724010
$2.96+1%
$2.99
Shipping from: China
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