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AMAOE BGA Reballing Stencil for XIAOMI 12 Pro Dimensity Middle Layer 70*70mm 0.12mm Middle Layer Tin Planting Steel Mesh
sku: 1005005235716463
$2.49
97.50 грн.
+5%
~
102.00 грн.
$2.49, $1.00 = 41.15 грн.
225.00 руб.
+1%
~
227.00 руб.
$2.49, $1.00 = 91.07 руб.
€ 2.30
-2%
~
€ 2.26
$2.49, € 1.00 = $1.11
Shipping from: China
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AMAOE BGA Reballing Stencil for XIAOMI 12 Pro Dimensity Middle Layer 70*70mm 0.12mm Middle Layer Tin Planting Steel Mesh
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AMAOE ZFold3 BGA Reballing Stencil for SAMSUNG SM-F926/U/W/B/N/0/D/J_S SM-W2022 70*70mm 0.12mm Tin Planting Steel Mesh
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AMAOE YM2300C4T4MFB Tin Planting Platform for AMD Notebook CPU/YM2500/3700 70*70mm 0.20mm BGA Reballing Stencil Set
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AMAOE S23Ultra Middle Layer Planting Tin Platform Set for SAMSUNG SM-918U 70*70mm 0.12mm BGA Reballing Stencil Kit
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AMAOE SR1YJ Tin Planting Platform Kit for SR1YW/SR1UT/SR1UU/SR29H/SR29F/SR2KQ 70*70mm 0.20mm BGA Reballing Stencil Set
-62%
18%
$3.78
AMAOE SR2WB Tin Planting Platform Kit for SR2WC/SR2/WA/W8/WE/Z2 SR3MD 70*70mm 0.20mm BGA Reballing Stencil
+8%
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$3.83
AMAOE 12 Generation SRLD8 Tin Planting Platform Set for Intel Notebook CPU Positioning Plate 70*70mm 0.3mm BGA Reballing Stencil
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$3.92
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$2.09
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+1%
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1%
$2.80
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$58.90
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0.182, 9.96
7/.115,448 0=.009,066 1=.007,782/1 2=.006,967/1 3=.035,320/1 4=.005,710/1 5=.022,248/1 6=.011,496/1 7=.025,925/36
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