AMAOE BGA Reballing Stencil Set for 14-15Series 0.12mm Mobile Phone Middle Layer CPU IC Tin Planting Steel Mesh Kit

AMAOE BGA Reballing Stencil Set for 14-15Series 0.12mm Mobile Phone Middle Layer CPU IC Tin Planting Steel Mesh Kit
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sku: 1005006723816568
$3.73
Shipping from: China
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