25k/ bottle Diameter Bga Reballing Soldering Iron Leaded Solder 0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76MM Free shippingl

25k/ bottle Diameter Bga Reballing Soldering Iron Leaded Solder 0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76MM Free shippingl
sku: 32917692478
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$11.80
Shipping from: China
   Technical Details
Application: BGA chip repair
diameter: 0.2/0.25/0/3/0.6mm
Flux Content: 2.0%
Flux Content: 96.5
Lead: Sn63%Pb37%
Material: Solder balls
Melting Point: 180
Model Number: sn63/37pb
Operating Temperature: 180-200 degree
Type: Lead / Lead Free
Use: BGA ball planting
Weight: Thousands loaded
   Price history chart & currency exchange rate

Customers also viewed