25k/ bottle Diameter Bga Reballing Soldering Iron Leaded Solder 0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76MM Free shippingl
sku: 32917692478
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$11.80
Shipping from: China
Technical Details
Application: | BGA chip repair |
diameter: | 0.2/0.25/0/3/0.6mm |
Flux Content: | 2.0% |
Flux Content: | 96.5 |
Lead: | Sn63%Pb37% |
Material: | Solder balls |
Melting Point: | 180 |
Model Number: | sn63/37pb |
Operating Temperature: | 180-200 degree |
Type: | Lead / Lead Free |
Use: | BGA ball planting |
Weight: | Thousands loaded |
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