250K/Bottles BGA Reballing Balls (0.25,0.3,0.35,0.4,0.45mm) BGA Solder Ball leaded For BGA Rework Repair Tools
Характеристики
Application: | BGA reballing |
Balls Alloy: | Sn63/Pb37 |
Feature: | Welding Tools Accessories |
Flux Content: | 63(%) |
Material: | Tin |
Model Number: | MM-198 |
number: | 250,000pcs/Bottle |
Particle Size: | 25-48μm |
Type: | Welding &Soldering Tools |
Usage: | for IC chip BGA SMD PGA PCB |
Use as: | Solder Tin |
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