25000pcs/bottle BGA Reballing Balls 0.2-0.65mm Leaded For IC Chip Soldering Accessories Solder Ball Tin Material Sn63/Pb37 Rewor
Характеристики
Balls League: | Sn63 / Pb37 |
Date: | 8-31 |
Model Number: | Solder Ball |
Particle Size: | 1-10μm |
quantity: | 25,000 PCS per Bottle |
Standard: | RoHs Available & SGS Tested |
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