250000pcs/bottle 0.2-0.76mm BGA Reballing Balls Leaded For IC Chip Soldering Accessories Solder Ball Tin Material 96.5Ag3Cu0.5
Характеристики
Application: | ball |
diameter: | 0.76 |
Material: | Tin |
Melting Point: | 217 |
Model Number: | 0.76 |
Weight: | 1 |
График изменения цены & курс обмена валют