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2 Pcs BGA Stenci For MEIZU Pro 7 meilan X BGA Stenci MT6757V CPU Reballing Planting Tin Net Repair Tools BGA Stenci
sku: 4000198133511
$7.35
-1%
$7.30
286.00 грн.
+5%
~
301.00 грн.
$7.30, $1.00 = 41.20 грн.
675.00 руб.
-4%
~
650.00 руб.
$7.30, $1.00 = 88.83 руб.
€ 6.85
-3%
~
€ 6.65
$7.30, € 1.00 = $1.10
Shipping from: China
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MT6757V CPU EMMC POWER AUDIO USB WIFI/BT PM IC CHIP For Meizu Pro 7/meilan X BGA Reballing Stencil Tin Solder Template
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22%
$4.68
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20%
$4.68
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17%
$4.68
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15%
$4.68
For Samsung J1 J2 J3 J4 J100 J320F G570M BGA Stencil Exynos7570 3475 SC9830A CPU Reballing Planting Tin Net Repair Tools BGA Stenci
14%
$4.68
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Japanese steel plate BGA Stencil For HUAWEI HI6290 HI3690 HI9500 HI6280 5G CPU Reballing Planting Tin Mesh, BGA Stenci Repair
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BGA Stencil for Xiaomi Redmi K30 Pro MI 10 Pro SM865 SM8250 CPU Reballing Planting Tin Mesh, BGA Stenci Repair
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AMAOE MZ1-MZ7 BGA Reballing Stencil for MEIZU CPU Universal 0.12mm Tin Planting Steel Mesh
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0.143, 9.78
7/.085,018 0=.000,120 1=.001,163/1 2=.002,279/1 3=.000,863/1 4=.002,419/1 5=.010,847/1 6=.003,492/1 7=.063,955/36
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