1pcs High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361

1pcs High quanlity 0.25mm BGA reballing Solder template stencil Chipset for huawei P8 P9 H6220/HI6250/MSM8952/CPU hi6361
sku: 33021545841
$4.64
Shipping from: China
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