1Pcs Lead Free Syringe Solder Flux Tin Paste BGA Welding Flux for Phone PCB Rework Repair

1Pcs Lead Free Syringe Solder Flux Tin Paste BGA Welding Flux for Phone PCB Rework Repair
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sku: 1000008352288
$4.93
Shipping from: China
   Technical Details
Application: For BGA Reballing
Ingredients: Sn99% Cu0.7% Ag0.3%
Melting Point: 138 degree
Model Number: BST-706 Solder Paste
Particle Size: 10-25μm
   Price history chart & currency exchange rate

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