1Pcs Lead Free Syringe Solder Flux Tin Paste BGA Welding Flux for Phone PCB Rework Repair
Technical Details
| Application: | For BGA Reballing |
| Ingredients: | Sn99% Cu0.7% Ag0.3% |
| Melting Point: | 138 degree |
| Model Number: | BST-706 Solder Paste |
| Particle Size: | 10-25μm |
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