16pcs/lot IC Chip BGA Reballing Stencil Kits Set Solder template for iphone X 8 7 6s 6 plus SE 5S 5C 5 4S 4 iPad high quality
Характеристики
Brand Name: | HDCSUN |
Model: | for iPhone,iPad |
Model Number: | BGA Reballing Stencil |
Package Size: | 27cm x 23cm x 5cm (10.63in x 9.06in x 1.97in) |
Package Weight: | 0.16kg (0.35lb.) |
Particle Size: | 5-15μm |
Unit Type: | piece |
График изменения цены & курс обмена валют