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15Pcs RELIFE Samsung Galaxy Note All Series Qualcomm MTK CPU CHIP Tin Planting Soldering Integrated Steel Stencil Set
sku: 1005005691973998
$29.10
-7%
$27.08
1,150.00 грн.
-3%
~
1,110.00 грн.
$27.08, $1.00 = 41.05 грн.
2,630.00 руб.
-6%
~
2,470.00 руб.
$27.08, $1.00 = 91.12 руб.
€ 26.80
-9%
~
€ 24.40
$27.08, € 1.00 = $1.11
Shipping from: China
the store does not ship to your country
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RELIFE RL-044 35PCS Android CPU Series Chip Planting Tin Steel Stencil Set Android CPU Tinned for Android Kirin Qualcomm
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$27.83
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$27.58
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43%
$42.88
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41%
$25.48
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38%
$47.91
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33%
$42.46
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31%
$8.43
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29%
$13.11
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26%
$13.25
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-1%
22%
$39.80
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17%
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15%
$41.49
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13%
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12%
$31.77
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6%
$28.02
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
5%
$31.68
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+4%
3%
$28.02
XZZ L23 CPU Reball Kit Stencil For IOS iPhone A8-A16 MTK Hisilicon Qualcomm Universal Magnetic Base BGA Balls Tin-planting Table
1%
$40.50
RELIFE 15Pcs RL-044 For SAMSUNG Series BGA Reballing Stencil Template Repair Tin Planting Stencil Kit Mobile Phone Chip Repair
+1%
1%
$48.83
RELIFE RL-044 58PCS BGA Reballing Stencil Set for Qualcomm |Snapdragon Dimensity Hisilicon Kirin Exynos Chip Planting Tin Net
1%
$31.57
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1%
$14.10
MaAnt C1 Magnetic Power CPU BGA Reballing Stencil Kit Platform Tin Planting Steel Mesh For iPhone Hisilicon Qualcomm MTK Stencil
1%
$31.59
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1%
$41.38
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1%
$23.80
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1%
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