10CC RMA-218 BGA Reballing No-Clean Repair Solder Flux Paste with Needle

Features : RMA-218 is a high viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages. It has less residue, good tinning, bright soldering point and less smoke, you can rest assured to use it. Widely used for moderate activity of rosin flux paste, the phone card computer graphics card SMD rework. Hood quality. The flux paste can stick more tighter. RMA-218 Flux And Needle ONLY,other accessories demo in the picture is not included. Specification : Model: RMA-218 Material: Plastic+Solder Paste Volume: 10CC Package includeds : 1 x RMA-218 Flux 1 x Needle Details pictures :