10CC NC-559-ASM UV Flux Lead Free Soldering Material Solder Paste For BGA CSP Ch

Detail: *This NC-559-ASM Soldering Paste is used for BGA/CSP ball semiconductor packaging repair. *No-clean solder paste very little and colorless residue without washing. *Suitable for computer motherboard north and south bridge communications graphics or other BGA. *Excellent soldering paste just use a little each time. *Good BGA soldering flux paste and machine regardless of manual welding the success rate is greatly increased. *Item Condition: Brand New *Color: As Pictures Show *Capacity: 10CC *Model:NC-559-ASM Package Contents: 1*NC-559-ASM Soldering Paste Notes: The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness.