10CC Lead Free BGA Solder Paste Solder Flux Mobile Phone Repair Welding Needle

10CC Lead Free BGA Solder Paste Solder Flux Mobile Phone Repair Welding Needle
Eachine1
sku: 1600040
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$8.99
Shipping from: China
   Description
Features Suitable for BGA ball semiconductor packaging repair Computer motherboard north and south bridge communications graphics and other BGA apply Just apply a little each time Its currently the best on the market BGA CSP rework help paste When the bumping of the BGA chip coated with flux paste and PCB pads are required coat Good BGA soldering flux paste and machine regardless of manual welding the success rate is greatly increased Package Included 1 x 10CC Lead Free BGA Solder PasteDetail Pictures
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