100g NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease

Product description: NC-559-ASM BGA flux solder paste flux 100g flux High-viscosity no-clean flux can be used for rework fixing balls or pins to BGA CGA and CSP packages and assembly operations. For example the flip chip is fixed on the PWB substrate and the good formula of BGA ball/ball can make the ball adhere more. Package list: 1 * Soldering paste Note: 1. The real color of the item may be slightly different from the pictures shown on website caused by many factors such as brightness of your monitor and light brightness. 2. Please allow slight manual measurement deviation for the data.