1 Bottle BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm leaded Solder Ball For BGA Rework Repair Tool

1 Bottle BGA Reballing Balls 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm leaded Solder Ball For BGA Rework Repair Tool
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sku: 4000086653148
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$2.46
Shipping from: China
   Technical Details
Application: Mobile Phone Repair
diameter: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm
Lead Pb: 37%
Material: Tin
Model Number: solder tin
Sn content: 63%
   Price history chart & currency exchange rate

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