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0.12mm Amaoe Mi 9 BGA Reballing Stencil for Xiaomi 8 8se MIX 2s Snapdragon SDM 845 710 CPU RAM POWER WIFI IC Chip Steel Mesh
sku: 1005003655976210
$2.08
-2%
$2.04
81.00 грн.
+3%
~
83.50 грн.
$2.04, $1.00 = 41.00 грн.
190.00 руб.
-4%
~
182.00 руб.
$2.04, $1.00 = 89.31 руб.
€ 1.93
-5%
~
€ 1.83
$2.04, € 1.00 = $1.11
Shipping from: China
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0.12mm Amaoe Mi 9 BGA Reballing Stencil for Xiaomi 8 8se MIX 2s Snapdragon SDM 845 710 CPU RAM POWER WIFI IC Chip Steel Mesh
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Amaoe Mi9 BGA Reballing Stencil for Xiaomi 8 8se MIX 2s Snapdragon SDM 845 710 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
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Amaoe Mi9 BGA Reballing Stencil for Xiaomi 8 8se MIX 2s Snapdragon SDM 845 710 CPU RAM POWER WIFI AUDIO IC Chip Steel Mesh
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0.12mm Amaoe MI:9 BGA Reballing Stencil for Xiaomi 8 / 8se / MIX 2s SDM845 / 710 / CPU Steel Mesh / mi9 Bga Stencil Plate
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Amaoe MI9 For XIAOMI 8/8SE/MIX 2S For Snapdragon 845/710 SDM845/SDM710 PM845 CPU POWER Chip BGA Stencil IC Solder Reballing
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Трафарет Amaoe для реболлинга BGA MI9 для Qualcomm Snapdragon 845 710 SDM845 710 CPU Xiaomi 8 8SE MIX 2s инструменты для ремонта телефонов
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Amaoe MI9 BGA Reballing Stencil For Xiaomi 8 8SE Mix2S SDM845 SDM710 For Qualcomm Snapdragon 845 710 PM845 PMI8998 PM8005 SDR845
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Amaoe MI9 BGA Reballing Stencil For Xiaomi8 8SE MIX 2s Qualcomm Snapdragon845 710 SDM845 710 CPU RAM Tin Planting Net
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