0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net Motherboard IC Chip Ball
sku: 33011602346
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.46
Shipping from: China
Technical Details
| Application: | Phone Logic Board Repair Tool |
| Brand Name: | BES |
| DIY Supplies: | Electrical |
| Dropship: | Support |
| Function: | Motherboard IC Chip Ball Soldering Net |
| Material: | Stainless Steel |
| Model Number: | Mobile Phone Logic Board Repair |
| Package: | Bag |
| Size: | 78 X 98 MM |
| Suit: | For HUAWEI MT8 P9 |
| Supplies: | DIY Repair Tool |
| Type: | Combination |
| Use For: | BGA Reballing Stencil Template |
| Wholesale: | Support |
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