0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net Motherboard IC Chip Ball

0.12MM High Precision BGA Reballing Stencil Template for Huawei Logic Board Soldering Repair Tin Net Motherboard IC Chip Ball
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sku: 33011602346
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.46
Shipping from: China
   Technical Details
Application: Phone Logic Board Repair Tool
Brand Name: BES
DIY Supplies: Electrical
Dropship: Support
Function: Motherboard IC Chip Ball Soldering Net
Material: Stainless Steel
Model Number: Mobile Phone Logic Board Repair
Package: Bag
Size: 78 X 98 MM
Suit: For HUAWEI MT8 P9
Supplies: DIY Repair Tool
Type: Combination
Use For: BGA Reballing Stencil Template
Wholesale: Support
   Price history chart & currency exchange rate

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