0.12MM AMAOE BGA Reballing Stencil Template for LG G2 G3 G4 G5 G6 V30 Phone Motherboard Soldering Repair Tin Plant Steel Net
sku: 32996717810
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$5.99
Shipping from: China
Technical Details
| Advantage: | Best BGA Repair Solution for Samsung Circuit Board |
| Application: | phone repair tool |
| Brand Name: | DIYPHONE |
| Color: | As Pictures Shows |
| Compacity: | for LG G2 G3 G4 H790 V10 H968 VS986, etc. |
| design: | CPU Universal Series Tin Template |
| DIY Supplies: | Electrical |
| Features: | Imported Japan Steel Mesh |
| Function: | for Phone Chip IC Repairing |
| item name: | BGA Reballing Tin Net |
| Material: | Imported Japan Stainless Steel Sheet |
| Model Number: | for Phone CPU Reballing Stencil Template |
| Package: | Box |
| Period of Dispatch: | Within 3 Days |
| Size: | 0.12mm BGA Reballing |
| Suitable for: | Universal LG G2 G3 G4 G5 G6 V30 All Series BGA Rework |
| Supplier: | DIYPHONE |
| Thickness: | 0.12MM |
| Type: | Phone Repair tool |
| Usage: | for Phone CPU Series New type Tin Net |
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