Wozniak For iPhone 8 CPU A10 A11 for Edge Cutting Glue Disassembly Chip Lamination Of Main Board Special Blade BGA Rework Suit

Wozniak For iPhone 8 CPU A10 A11 for Edge Cutting Glue Disassembly Chip Lamination Of Main Board Special Blade BGA Rework Suit
sku: 32857363069
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$12.50
Shipping from: China
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