Stainless Steel BGA Stencil for NOTE4 APQ8084 CPU BGA529 EMCP BGA Reballing 0.12mm Thickness Solder Template
Technical Details
Application: | BGA Stencil for Samsung NOTE4 APQ8084 CPU BGA529 EMCP |
Material: | Stainless Steel |
Model Number: | BGA Stencil |
Thickness: | 0.12mm Thickness |
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