SS-032 Middle Layer Board BGA Reballing Stencil Plant Tin Platform For iPhone X Motherboard Repair With SP-X Solder Paste Flux

SS-032 Middle Layer Board BGA Reballing Stencil Plant Tin Platform For iPhone X Motherboard Repair With SP-X Solder Paste Flux
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sku: 4000083552748
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$37.40
Shipping from: China
   Technical Details
Model Number: SS-032
Particle Size: 20-38μm
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