SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X
Eachine1
sku: 1336688
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$9.26
Shipping from: China
Description
Features: High density, high impedance Pure alloy compositin Fine and sticky Stannum planting, not bubbing Silver containing highlight Model: SP-X Weight: 50g Size: 38 x 31 x 35mm Melting Point: 158 Package Included: 1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste Detail Pictures:
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