RELIFE RL-044 BGA Reballing Stencil For IPHONE HUAWEI Samsung XIAOMI CPU RAM Power IC Chip Reball Pin BGA Direct Heat Template
sku: 1005006112870500
116.00 грн.+3%
~ 120.00 грн.
$2.69, $1.00 = 44.50 грн.
208.00 руб.-1%
~ 206.00 руб.
$2.69, $1.00 = 76.59 руб.
€ 2.30+2%
~ € 2.36
$2.69, € 1.00 = $1.14
Shipping from: China
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Price history chart & currency exchange rate
