RELIFE No-clean Soldering Paste RL-400 RL-401 RL-402 40g Sn63/Pb67 183°C Solder Paste for iphone phone BGA Reballing Soldering
Характеристики
| Apply: | BGA Solder Flux Paste |
| Brand Name: | NoEnName_Null |
| Factory: | RELIFE |
| Feature: | No-clean Soldering Paste |
| Function: | Sn63/Pb67 183°C |
| Model: | RL-400 RL-401 RL-402 |
| Model Number: | Solder Paste Flux |
| Particle Size: | 20-38μm |
| Use: | BGA Soldering Tin Cream |
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