Qianli 3D CPU BGA Reballing Stencil Kit Tin Plant Net Solder Heating Template for A12 A11 A10 A9 A8 Motherboard Repair
Technical Details
| Application: | For iPhone A12 A11 A10 A9 A8 Reballing |
| Material: | Stainless Steel |
| Model Number: | Qianli Golen CPU BGA Reballing Stencil |
| Particle Size: | 1-10μm |
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