PHONEFIX Qualcomm Series BGA Reballing Stencil Template for iPad A96 MSM8917 for Samsung Huawei MSM8992 LG BGA IC Chip Repair
Technical Details
| Advantage: | Best BGA Repair Solution for Huawei Samsung Circuit Board |
| Application: | phone repair tool |
| Brand Name: | DIYPHONE |
| Color: | As Pictures Shows |
| Compacity: | for Phone Motherboard Repairing |
| DIY Supplies: | Electrical |
| Features: | BGA Reballing Stencil Plate Kit for Samsung Huawei MTK LG |
| Function: | Phone BGA IC Chips Reballing |
| item name: | BGA Reballing Stencils Template |
| Material: | Steel Sheet |
| Model Number: | A96 iPad/MSM8917 Samsung Huawei MSM8992 LG |
| Package: | Box |
| Size: | BGA Reballing Stencil |
| Suitable for: | for A96 iPad/MSM8917 Samsung Huawei MSM8992 LG CPU BGA Reballing |
| Supplier: | DIYPHONE |
| Type: | Phone Repair tool |
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