PHONEFIX High Synthetic BGA Solder Flux Paste BGA Soldering Tin Cream XG-Z40 for Mobile Phone Repair PCB BGA SMD PGA repair

PHONEFIX High Synthetic BGA Solder Flux Paste BGA Soldering Tin Cream XG-Z40 for Mobile Phone Repair PCB BGA SMD PGA repair
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sku: 33002795755
$2.99
Shipping from: China
   Technical Details
Alloy: Sn63/Pb37
Application: Applicable to Phone PCB, BGA, SMD, PGA Repair
Brand Name: NoEnName_Null
design: Needle Tube
diy type: Computer, Phone Chip Reballing
Drop ship: Support
Features: High Viscosity No-clean Flux
Function: Repair the Circuit Boards, Protect The Electronic Components
is-customized: No
item name: BGA Soldering Tin Cream
Material: Tin+Solder Paste
Microns: 25-38um
Model: Dispenser Needle Solder
Model Number: XG-Z40
Particle Size: 25-48μm
Product: XG-Z40
quantity: One/Lots
Size: Approx 1.30*1.30*1.14inch / 3.3*3.2*2.9cm
Suitable for: Phone, Computer Repair Industry
Type: BGA Soldering Paste
Usage: PCB BGA Repairing Tool
Volume: 10ml
With Squeeze Tube: Yes
   Price history chart & currency exchange rate

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