NC-559-ASM-UV (TPF) Welding Flux Lead-Free No-Clean BGA Rosin Anointed Tacky Flux for Sphere Attachment, Reballing, Chip Solder Flux

NC-559-ASM is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. NC-559-ASM may be used for BGA sphere attachment and reballing. NC-559-ASM is also designed to work on all flip chip bumping and chip scale packaging sites.