MJ 3D BGA stencil kit for iPhone A8 A9 A10 A11 A12 CPU BB baseband Power ic BGA chip reball Solder tin plate

MJ 3D BGA stencil kit for iPhone A8 A9 A10 A11 A12 CPU BB baseband Power ic BGA chip reball Solder tin plate
thumb
thumb
thumb
thumb
thumb
thumb
sku: 32946568875
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$11.90
Shipping from: China
   Price history chart & currency exchange rate