MIJING CH3 3 in1 Universal Mainboard Layred Welding Platform For iPhone X/XS/XSMAX CPU chip HHD Baseband Glue Removal.

MIJING CH3 3 in1 Universal Mainboard Layred Welding Platform For iPhone X/XS/XSMAX CPU chip HHD Baseband Glue Removal.
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sku: 33006060399
$64.00
Shipping from: China
   Technical Details
Application: for iphone x Separation of upper and lower main board
Brand Name: wozniak
DIY Supplies: Electrical
Model Number: mijing ch3
Package: Bag
Size: 125*90*38mm
Temperature: 185 degrees
Type: Heating Station
Use: support A11 A12 CPU chip, A11 A12 HHD,
Volt: 220V
Weight: 1.25KG
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