MIJING CH3 3 in1 Universal Mainboard Layred Welding Platform For iPhone X/XS/XSMAX CPU chip HHD Baseband Glue Removal.
Technical Details
Application: | for iphone x Separation of upper and lower main board |
Brand Name: | wozniak |
DIY Supplies: | Electrical |
Model Number: | mijing ch3 |
Package: | Bag |
Size: | 125*90*38mm |
Temperature: | 185 degrees |
Type: | Heating Station |
Use: | support A11 A12 CPU chip, A11 A12 HHD, |
Volt: | 220V |
Weight: | 1.25KG |
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