For Samsung S6 S6+ Note5 S8 S8+ Note8 S9 S9+ S7 Series BGA Reballing Stencil Kit CPU Chip Heating Reballing Heating Template
Technical Details
| Application: | S9 S9+ |
| Feature: | Anti Drum-up |
| Model Number: | 0899 |
| Particle Size: | 5-15μm |
Price history chart & currency exchange rate



