CPU Module Motherboard Reballing Kit Stencils Tin Planting Network Steel Net Repair Tool For iPhone 5S/6/6S/7/7P/8/8P A7 A8 A9 A10 A11

CPU Module Motherboard Reballing Kit Stencils Tin Planting Network Steel Net Repair Tool For iPhone 5S/6/6S/7/7P/8/8P A7 A8 A9 A10 A11
Eachine1
sku: 1463097
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$6.77
Shipping from: China
   Description
Features: 3D laser square hole BGA reballing stencil template. High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient. New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard. Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way. Specification: Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU Package included: 1 x BGA Reballing Tool Details pictures:
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