BGA Reballing Stencil MSM8996 CPU Universal Series Tin Template for Samsung Galaxy S9 S8 S7 S6 Motherboard Soldering Repair
sku: 32983898012
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$5.99
Shipping from: China
Technical Details
Advantage: | Best BGA Repair Solution for Huawei Samsung Circuit Board |
Application: | phone repair tool |
Brand Name: | DIYPHONE |
Color: | As Pictures Shows |
Compacity: | for Phone Motherboard BGA IC Chips Rework |
DIY Supplies: | Electrical |
Features: | Multi-purpose Samsung S8 Note8 BGA Reballing Stencil Template |
Function: | for Samsung Phone BGA IC Reballing |
item name: | BGA Reballing Stencils Template |
Material: | Imported Japan Steel Sheet |
Model Number: | Samsung S9 S8 S7 S6 |
Package: | Box |
Size: | BGA Reballing Stencil |
Suitable for: | for Samsung C7010 J610 CPU BGA Reballing |
Supplier: | DIYPHONE |
Thickness: | 0.12mm |
Type: | Phone Repair tool |
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