Amaoe QU5 BGA Reballing Stencil 0.12mm CPU Chip IC Tin Planting Steel Mesh for Qualcomm SDM670 710/845/MSM8917/SM6150/8150 CPU

Amaoe QU5 BGA Reballing Stencil 0.12mm CPU Chip IC Tin Planting Steel Mesh for Qualcomm SDM670 710/845/MSM8917/SM6150/8150 CPU
sku: 1005004062813890
$4.22
Shipping from: China
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