Amaoe Middle Layer BGA Reballing Stencil for Huawei nova6 5G/V30 5G CPU IC Chip Tin Planting Soldering Net 0.12MM thickness

Amaoe Middle Layer BGA Reballing Stencil for Huawei nova6 5G/V30 5G CPU IC Chip Tin Planting Soldering Net 0.12MM thickness
sku: 1005003670565023
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$9.00
Shipping from: China
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