Amaoe Middle Layer BGA Reballing Stencil for Huawei P30Pro CPU IC Chip Tin Planting Soldering Net 0.15MM thickness

Amaoe Middle Layer BGA Reballing Stencil for Huawei P30Pro CPU IC Chip Tin Planting Soldering Net 0.15MM thickness
sku: 1005003670358987
ACCORDING TO OUR RECORDS THIS PRODUCT IS NOT AVAILABLE NOW
$9.00
Shipping from: China
   Price history chart & currency exchange rate