Amaoe HI6250 CPU BGA Stencil Bottom Layer IC Reballing Chip Solder Ball Tin Plant Net Rework Heat Template Steel Mesh

Amaoe HI6250 CPU BGA Stencil Bottom Layer IC Reballing Chip Solder Ball Tin Plant Net Rework Heat Template Steel Mesh
sku: 1005005339808219
$2.05
Shipping from: China
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