Amao HI1 BGA Reballing Stencil For HUAWEI 6555 HI6521M HI6561 HI6422 HI6553 HI6421 HI6523 HI6551 HI6921 Power IC Chip Steel Mesh

Amao HI1 BGA Reballing Stencil For HUAWEI 6555 HI6521M HI6561 HI6422 HI6553 HI6421 HI6523 HI6551 HI6921 Power IC Chip Steel Mesh
thumb
thumb
sku: 1005002677963920
$2.90-2%
$2.85
Shipping from: China
   Price history chart & currency exchange rate