A13 CPU RAM BGA Stencil For iPhone 11/Pro/Max Top Uppper Bottom Layer Reballing IC Chip Pins Solder Tin Plant Net Heat Template

A13 CPU RAM BGA Stencil For iPhone 11/Pro/Max Top Uppper Bottom Layer Reballing IC Chip Pins Solder Tin Plant Net Heat Template
sku: 4000353505176
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$6.50
Shipping from: China
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