1Pcs 10CC Syringe Solder Paste Medium temperature 183 degree Tin Paste Soldering Flux for Phone PCB BGA Rework Repairing
Technical Details
| Application: | For BGA Reballing |
| Melting Point: | 183 degree |
| Model Number: | BST-510 Solder Paste |
| Operating Temperature: | 250-380 Celsius |
| Particle Size: | 10-25μm |
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