12.5K x 7 Bottles BGA Reballing Soldering Balls Lead Solder Ball Set For BGA Rework Reballing Stencil Welding Solder Tools Set
Technical Details
| Application: | BGA reballing |
| Balls Alloy: | Sn63/Pb3 |
| Drop Shipping: | Support |
| Material: | Tin |
| Model Number: | MM-213 |
| number: | 12500/Bottle*7 |
| Particle Size: | 25-48μm |
| Size: | 0.25,0.3,0.35,0.4,0.45,0.5,0.6 mm |
| The size of the bottle is fixed: | The bigger the Reballing Balls, the more loaded it is. |
| Type: | Welding Tools Accessories |
| Usage: | for IC chip BGA SMD PGA PCB |
| Use as: | Solder Tin |
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