10CC RMA-218 BGA Reballing No-Clean Repair Solder Flux Paste with Needle

Features RMA 218 is a high viscosity no clean flux that can be used for rework sphere or pin attachment to BGA CGA and CSP packages It has less residue good tinning bright soldering point and less smoke you can rest assured to use it Widely used for moderate activity of rosin flux paste the phone card computer graphics card SMD rework Hood quality The flux paste can stick more tighter RMA 218 Flux And Needle ONLY other accessories demo in the picture is not included Specification Model RMA 218Material Plastic Solder PasteVolume 10CC Package includeds 1 x RMA 218 Flux1 x NeedleDetails pictures