0.12mm BGA Reballing Stencil for Iphone 8g 8p 6 6P 6S 6SP 7 7P contains A8 A9 A10 A11 CPU tin planting network
sku: 32888087463
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$2.33
Shipping from: China
Technical Details
| A8 A9 A10 A11 Solder tin plate: | Square hole net IC Chip BGA Reballing Stencil |
| Application: | Computer Tool Kit |
| BGA stencil: | telephone tool |
| Brand Name: | wozniak |
| DIY Supplies: | Electrical |
| Groove solder paste pringting steel sten: | Plant tin stencil |
| Heating Stencil reballin: | BGA Reball Stenci |
| Model: | ppd Plant tin net |
| Model Number: | for iphoen 8g 8p 7g 7p |
| Package: | Case |
| plant tin: | Plant tin net |
| plant tin web: | BGA Reball Stencil |
| Size: | 8*8*2 |
| stencil bga: | bga reballing |
| Thickness: | 0.12mm |
| Type: | BGA Reball Stenci |
| Use: | for iohone a8 a9 a10 a11 |
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